DragonFly IV 3D Circuit Printer
The University of Nevada, Reno College of Engineering offers advanced Additively Manufactured Electronics (AME) capabilities with the Nano Dimension DragonFly IV and the Essemtec Fox systems. These tools bring cutting-edge circuit fabrication and assembly directly into our research and teaching environment. Industry collaborations are welcome.
Equipment
DragonFly IV – 3D Circuit Printing
Prints conductive silver and dielectric polymer with 18 μm resolution
Supports trace widths down to 75 μm
Fabricates devices up to 160 × 160 × 3 mm
Enables rapid prototyping and complex 3D geometries not possible with traditional PCBs
Essemtec Fox – SMT Assembly
Performs solder paste jet dispensing (no stencil needed)
Handles up to 200 feeders for high-mix components
Supports sizes from 01005 chips to 80 × 80 × 25 mm packages
Fast pick-and-place with quick changeovers
Ideal for research and small-batch production
Those systems are in the William N. Pennington Engineering Building. Standard operating procedures have been developed, and training is available for graduate researchers and undergraduate students. The DragonFly IV already is part of the University’s undergraduate antennas course and multiple research groups are exploring applications in antennas, rectennas and advanced packaging.
Partner with us
We support both academic and industry collaborations. Ongoing research focuses on high-frequency electronics, novel antennas, bio-electrodes and novel device packaging.
Contact us for operating procedures and pricing.
Professor Jeongwon Park
(775) 784-6975
Jepark@unr.edu
Associate Professor Jihwan Yoon
(775) 682-6869
Jihwany@unr.edu